Integration of Microelectronics in Specialty Yarns: Challenges in Durability and Scalable Manufacturing

Abstract

The application of microelectronics in specialty yarns is one of the most important developments towards the creation of wearable electronic systems with sensing, communication and energy func-tions (e textiles). But the rigidity of the electronic components and flexibility of the textile substrate poses a number of challenges in terms of durability, washable, and large scale manufacturing. In this paper, a general overview of the various microelectronics integration strategies is provided, moving from textile adapted to textile integrated and fully textile based (fiber/yarn level) systems. Particularly, conductive yarn technologies, fiber electronics and based on textile energy systems are emphasized. The mechanical fatigue, interconnection instability and scalability limitations are ex-plored in depth. While the integration of fiber level is the most promising direction for the devel-opment of smart textiles with long term durability and scalability, there are still many research gaps to be addressed in terms of standardization of manufacture and long-term reliability.